Long Beach, CA January 19, 2004 – TEK Microsystems, Inc. announced that Power RACE Chelmsford MA-3, the first platform to combine high-density FPGA-board switching, PowerPC and PMC interfaces. This new platform for integrated, high-speed I / S and treated with a single graphics slot. For example, the implementation of complex image processing, such as unmanned aerial vehicles (UAV) or advanced industrial control, Power RACE-3 can reduce the system board, 40 percent, reducing mass, power, volume and cost.

This is the first platform to fully exploit high-density port (3000000 gates) chips and processors appear in devices such as Xilinx Virtex Pro. TEK Microsystems Power RACE-3 boards and systems combine PowerPC and FPGA processing engines with powerful PMC I / O features. Notice of Power RACE-3 is the next step TEK Microsystems has been completed towards the provision of embedded systems, "says Andy REDDIG, chairman and CTO, TEK Microsystems., seismic data acquisition, As the leader in high performance two PMC modules, E / S, and integrated E / S fabric exchange solutions for continuously improving the technology to manage an increasing proportion of embedded computing systems a challenge.

This is a new model is built – using an FPGA and flexible, based on the core switch. Power RACE-3 is the first fully integrated platform is based on PowerPC offer configurable I / O handy built-in intelligent power management, seismic data acquisition, . Since the client-server, which also includes a common API technology provides rapid integration, seismic data acquisition, of low-risk and a seamless transition. Power RACE-3 uses two PowerPC 440GX 533 MHz to support high performance without causing CPU.

Currently supports the RACE + + fabric connections, future implementations of the fabric agnostic. Web-book gives each PMC site, data transmission stops in ports on board + +, FPGA, seismic data acquisition, processing, or memory argument in this way to remove material and improve overall performance. When the assembly is one of more than 30 available TEK Microsystems PMC modules,, seismic data acquisition, the new Power and RACE-3 offers unprecedented speed and flexibility. Included Power RACE-3 tekX programming environment that provides tools for fabric configuration, buffer management, data transfer, interprocessor communications, data recording / playback and streaming integration and FPGA I / O module tekX reduce product development system through a common API to protect the creative complexity of the fabric and equipment.

TekX environment supports all current models and Power RACE promote the integration of future products to apply the changes. The result is a low risk and a seamless technology upgrades.PMC / XMC Power RACE three modules can be determined for each of more than 30 TEK Microsystems, PMC I / O module TEK PMC modules consist of two separate parts. Front-end interfaces for FPDP I and II indications, Channel Link, LVDS, taxi, and more is the wife one of the three interfaces at the end of a standard 32-bit and 64-bit PCI.

Behind all the FPGA interfaces for customer-specific code can easily obtain maximum flexibility, efficiency and productivity. This project methods TEK brings the latest technology on the market, because they are born. XMC modules are currently being developed is Power RACE-3 is available 10-12 weeks ARO and priced at $ 17,500. Photos available: Please contact Dianne McDermott dmcdermott@tekmicro.comTEK, seismic data acquisition, Microsystems, Inc., founded in 1981, seismic data acquisition, and headquartered in Chelmsford, Mass.

, develops, manufactures and sells a wide range of advanced high-performance embedded systems and spreadsheets in real time. Comprehensive product range includes standard CD Power RACE Raceway is more than 30 papers and PMC (PCI Mezzanine Card). These products are used in real-time systems for data acquisition, instrumentation, control systems and signal processing in customer applications such as reconnaissance, signals intelligence, satellite telemetry, mine detection, medical imaging, radar, sonar, semiconductor inspection and seismic research.

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